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Solder joints on a multi-lead header form reliably only when every lead sits within the agreed coplanarity limit at the machine. Control the limit, the packaging and the incoming check, not just the reflow profile. Contents Part 1. What is coplanarity and why does it drive solder quality? Part 2. How do coplanarity defects appear […]

A header’s usable current is set by temperature rise in your application, not by the headline catalogue number. Read the rating’s conditions, then verify the real contact grouping and ambient. Contents Part 1. What does a header current rating actually describe? Part 2. Why does temperature rise matter more than the headline number? Part 3. […]

Treat the terminal block enclosure as part of the electrical interface, not merely a box around it. Clearance, creepage, conductor entry, materials, and service access must be reviewed in the controlled application. Contents Part 1. Define the enclosure interface Part 2. Separate clearance from creepage Part 3. Connect insulation coordination to conditions Part 4. Design […]

Decide which board carries pins and which carries sockets from wear, exposure and service logic, not habit. The pair works as one interface, so specify both halves together. Contents Part 1. What distinguishes a pin header from a socket header? Part 2. Which side of the interface should carry the sockets? Part 3. How do […]

Choose the connection architecture around the service task, not a generic preference for fixed or pluggable hardware. A terminal block can make field wiring direct and inspectable, while a plug-in connector can create a defined disconnect point; both need application-specific verification. Contents Part 1. Start with the serviceable power connection Part 2. Compare the connection […]

Choose a PCB header pitch from the current path, board density and assembly process together, not from the smallest catalogue value. Fix the system constraints first and let the pitch follow them. Contents Part 1. Why is pitch a system decision rather than a catalogue pick? Part 2. How do current and contact size interact […]